SK hynix, a leading semiconductor supplier based in Korea, is developing innovative products to meet the growing demand for artificial intelligence (AI) technology. The company's CMM-Ax product adds computational functionality to high-capacity memory, improving performance and energy efficiency of next-generation server platforms. Additionally, SK hynix plans to produce 6th generation HBM (HBM4) in the second half of this year to lead the customized HBM market. This move is expected to further accelerate AI-driven changes in the world.
https://www.prnewswire.com/news-releases/sk-hynix-to-unveil-full-stack-ai-memory-provider-vision-at-ces-2025-302341613.htmlSK Hynix, the world's second-largest memory chipmaker, has mass-produced a new type of NAND flash memory called 321-layer TLC 4D NAND flash. This technology is designed to meet the growing demand for high-capacity storage solutions in the artificial intelligence (AI) market. The 321-layer NAND offers a 12% increase in data transfer speed and a 13% improvement in reading performance compared to SK Hynix's previous 238-layer NAND. The company plans to supply these chips to customers starting in the first half of 2025, enabling the development of ultra-high-capacity solid-state drives (SSDs) that exceed 100TB in capacity.
https://www.techradar.com/pro/samsungs-archrival-becomes-first-chipmaker-to-launch-300-layer-tlc-nand-flash-memory-sk-hynixs-321-layer-1-terabit-tlc-paves-the-way-for-more-affordable-100tb-ssds